
Consolidation of copper and aluminium powders by spark plasma sintering
Author(s) -
M Saiprasad,
R Atchayakumar,
K. Thiruppathi,
S. Raghuraman
Publication year - 2016
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/149/1/012057
Subject(s) - spark plasma sintering , materials science , metallurgy , sintering , powder metallurgy , aluminium , alloy , copper , pulsed dc , sputter deposition , thin film , sputtering , nanotechnology