Open AccessEffect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate
Author(s) -
M.N. Ervina Efzan,
Wayne Ng,
Mohd Mustafa Al Bakri Abdullah
Publication year - 2016
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/133/1/012024
Subject(s) - wetting , soldering , flux (metallurgy) , materials science , alloy , metallurgy , substrate (aquarium) , copper , composite material , oceanography , geology
This paper investigated the effect of different types of fluxes on the wettability of a type of low temperature lead-free solder, 60Sn-40Bi alloy. The purpose of this paper is to investigate the effect of different types of fluxes on the wettability of 60Sn-40Bi solder (Tm : 138 -170 oC), so that the most compatible flux to be used with low temperature alloy can be determined.The results of this paper showed that the water soluble flux sample has the highest spread area and lowest contact angle. This meant that the solder has the highest wettability when water soluble flux is used, followed by RMA flux and low solids flux. Therefore, it was determined that water soluble flux is the most compatible to be used with the low temperature 60Sn-40Bi solder. The characteristic of this type of flux enables it to function well even at a low working temperature