Open AccessFatigue strength of copper and mild steel single lap joints bonded with epoxy-alumina nanocomposite adhesive
Author(s) -
S Dinesh Ram,
Dharmendra Kumar Shukla,
Aman Gupta
Publication year - 2022
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1248/1/012091
Subject(s) - materials science , composite material , epoxy , lap joint , adhesive , copper , shear strength (soil) , joint (building) , nanocomposite , metallurgy , structural engineering , environmental science , layer (electronics) , soil science , engineering , soil water