Open AccessImpact of plasma treatment on solderability of printed circuit boards
Author(s) -
Eszter Kocsis,
Attila Lukács,
I. Szalai
Publication year - 2022
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1246/1/012013
Subject(s) - solderability , wetting , soldering , materials science , printed circuit board , contact angle , flux (metallurgy) , miniaturization , electronics , composite material , plasma , dip soldering , metallurgy , nanotechnology , wave soldering , electrical engineering , engineering , physics , quantum mechanics