Open AccessTowards simulation of disassembly of bonded composite parts using the laser shock technique
Author(s) -
Panagiotis Kormpos,
Κωνσταντίνος Τσερπές,
Ioannis Floros
Publication year - 2022
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1226/1/012081
Subject(s) - shock (circulatory) , materials science , composite number , adhesive , focus (optics) , structural engineering , process (computing) , adhesive bonding , computer science , computer simulation , laser , ultimate tensile strength , stress (linguistics) , composite material , simulation , engineering , optics , layer (electronics) , medicine , linguistics , philosophy , physics , operating system