Open AccessModified Scheil equation for the Cu-Sn system and comparison of hardness and electrical conductivity of Cu-8.5wt% Sn alloy directionally solidified
Author(s) -
Roel Cruz,
Givanildo Alves dos Santos,
Marcos Roberto Lopes do Nascimento,
Rogério Teram,
Riccardo De Luca,
Vinícius Torres dos Santos,
M R da Silva,
Antônio Augusto Couto
Publication year - 2022
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1222/1/012014
Subject(s) - liquidus , solidus , eutectic system , alloy , materials science , volume fraction , electrical resistivity and conductivity , conductivity , metallurgy , thermodynamics , composite material , chemistry , physics , quantum mechanics
The Scheil equation, which estimates the concentration of solute in the solid at the solid/liquid interface, does not account for the curvatures of liquidus and solidus lines. We modified the equation to account for these curvatures and compared some microsegregation indexes obtained by the original and the new equations with data from the literature about the Cu-Sn system. The new one can furnish a better approximation of the range of concentration of solute, but a poorer estimate of the maximum volume fraction of the eutectoid mixture. At last, we compared the hardness and electrical conductivity of an upward solidified alloy of this system with its equivalent commercial one. The as-cast alloy has a lower hardness and a higher conductivity due to its columnar structure.