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Thermal stress analysis of disc brake using analytical and numerical methods
Author(s) -
I T Jiregna,
Hirpa G. Lemu
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1201/1/012033
Subject(s) - disc brake , rubbing , stress (linguistics) , brake , brake pad , mechanics , thermal , materials science , thermal analysis , transient (computer programming) , structural engineering , composite material , physics , engineering , thermodynamics , computer science , metallurgy , linguistics , philosophy , operating system
This article presents study of the thermal stress development in brake disc and the associated life cycle of the disc. The thermal stress analysis of disc brake under the first brake application and the influences of thermal loads on stress development of the disc have been investigated. The temperature distribution was conducted as a function of disc thickness and braking time. The study was done on the disc brake of Sports Utility Vehicle with a model of DD6470C. Partial solution approach was used to solve analytical temperature distribution through the thickness. The model was done using representative areas of the disc exposed to high temperature whose distribution result was obtained as a function of disc thickness and braking time. The solutions of coupled thermal transient fields and stress fields were obtained based on thermal-structural coupled analysis. Based on the model developed for the study, the positions of high and low stress formations were investigated, and it has been observed that thermal stress and temperature gradient show similar behavior through the thickness of disc. Generally, high temperature and stress components were found on the rubbing surfaces of the disc.

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