Open AccessEstimation of the thermal gap when soldering waveguide elements
Author(s) -
I. V. Kudryavtsev,
М. В. Брунгардт,
Э. А. Гончарова,
O A Li,
А В Колотов
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1155/1/012020
Subject(s) - soldering , thermal , materials science , fillet (mechanics) , composite material , stress (linguistics) , air gap (plumbing) , structural engineering , engineering , physics , thermodynamics , linguistics , philosophy
This paper proposes a method for determining the required gap between the elements of the waveguide path during its assembly by soldering. The need for a thermal gap is defined by difference in mass and dimensional parameters of the elements to be connected, due to which a significant no uniformity of heating and thermal deformations occur. The no uniformity of thermal deformations leads to jamming of one element in another, therefore, the heating time and the size of the thermal gap are need to be determined. The diameter of the solder wire is determined according to the size of the thermal gap and the required fillet of the soldered seam. The performed numerical calculations of the stress state of the obtained soldered seam showed the absence of stress concentration. Mechanical tests have confirmed the high strength of soldered seam.