Open AccessCooling of electronic components on the LTCC module with an embedded flat heat pipe
Author(s) -
Д. А. Нестеров,
V. V. Derevyanko,
Sergey B. Suntsov
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1139/1/012002
Subject(s) - heat pipe , materials science , ceramic , heat flux , heat sink , composite material , thermal resistance , capillary action , printed circuit board , heat spreader , electronic component , heat transfer , substrate (aquarium) , mechanical engineering , electrical engineering , thermodynamics , engineering , oceanography , physics , geology
The results of the experimental investigations of a ceramic circuit board sample with an embedded flat heat pipe are presented. The sample was made based on the technology of low temperature co-fired ceramic (LTCC). The flat heat pipe is formed at the bottom side of a ceramic substrate using a capillary structure made of sintered copper powder. The developed prototype of the LTCC module was used for the investigation of removing and spreading of high heat fluxes from high power electronic components mounted on the module. The embedded flat heat pipe filled with acetone provides 40 W/cm 2 of heat flux removal from the heat source with the heat dissipation area of 1 cm 2 . The measured value of the thermal resistance between the heat source and cooler surface under the module is 0.8 °C/W.