Open AccessPolymer nanocomposites with nanostructured copper flakes for protection as barrier in packaging materials in food industry
Author(s) -
Sudha R. Karbari,
Kiran Guru Prasad Shetty,
Nivedita S Desai
Publication year - 2021
Publication title -
iop conference series: materials science and engineering
Language(s) - English
Resource type - Journals
ISSN - 1757-8981
DOI - 10.1088/1757-899x/1136/1/012063
Subject(s) - nanocomposite , polymer , materials science , copper , polymer nanocomposite , composite material , thermal diffusivity , moisture , food packaging , barrier layer , matrix (chemical analysis) , diffusion barrier , layer (electronics) , nanotechnology , chemical engineering , chemistry , metallurgy , physics , food science , quantum mechanics , engineering
Polymer nanocomposites as multilayered and single layer are used as barrier protection for the entry of UV and moisture. Here the polymer nanocomposites with novel nanoflakes are simulated with the optimized geometry of nanoflakes. The barrier properties are verified with the change in width of the dispersed nanoflakes of polymer matrix. The optimization of the copper nanoflakes is investigated and studied using two model with different dimensions of the nanoflakes in the polymer nanocomposite. The diffusivity flux at the interface of air and the polymer matrix varies from 5×10 -12 mol/(m 2 s) and 4 ×10 -5 mol/(m 2 s) for the models proposed.