Open AccessA Review on Electronics Cooling using Nanofluids
Author(s) -
T. Balaji,
C. Selvam,
D. Mohan Lal
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1130/1/012007
Subject(s) - electronics , nanofluid , electronics cooling , heat sink , materials science , power electronics , heat flux , heat transfer , thermal resistance , thermal conductivity , heat exchanger , heat transfer coefficient , thermal grease , thermal , mechanical engineering , mechanics , electrical engineering , nanotechnology , power (physics) , engineering , thermodynamics , composite material , nanoparticle , physics
Continuous reduction in the size of the electronics for space limitations with higher processing speed generates high heat flux density from the electronics chips during its operational mode. However, this increased heat flux density causes a major problem for the electronics and leads to the failure of the components if not removed properly. This paper investigates the various cooling techniques especially the liquid cooling system operated with nanofluids-a special kind of fluid with the dispersion of nanometre sized particles. This paper quantifies the various kinds of nanofluids used for electronics cooling along with its thermal performance by targeting on the thermal characteristics such as heat transfer coefficient, thermal resistance, thermal conductance, interface temperature, etc. This paper also quantifies the operation of nanofluids over the various geometries of micro channel heat exchangers that serve as a heat sink for power dissipation from the electronics.