Open AccessOptimization of Cooling Fan Speed for Heat Transfer Enhancement of Electronic Chip Using CFD
Author(s) -
Sanjeev Kumar Gupta,
Nitin Kukreja
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1116/1/012107
Subject(s) - computational fluid dynamics , heat transfer , fluent , turbulence , mechanics , mechanical engineering , forced convection , heat transfer enhancement , water cooling , chip , materials science , heat transfer coefficient , computer science , simulation , engineering , physics , telecommunications
Demand of high-performance personal computers have highly increased today which in turn has increased the need for the efficient cooling system. In heat transfer through forced convection phenomenon, the former depends upon the variation in fluid velocity. The analysis of this paper results that variation in fluid velocity plays a key role in increasing the heat transfer rate and helps to meet the desired cooling environment for the safe performance of electronic components. The fan location is fixed above the chip and fluid velocity is varied and behavior of heat transfer rate is visualized for better design of the cooling system. Simulation has been carried out on ANSYS 15.0 (modeling on ICEM CFD & results from FLUENT). The k-ॉ turbulence model has been applied.