Open AccessDrop test analysis of ball grid array package using finite element method
Author(s) -
Jeremias A. Gonzaga,
Aristotle T. Ubando,
Emmanuel Arriola,
R L Moran,
N R E Lim,
J P Mercado,
A Conversion,
D Belarmino
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1109/1/012023
Subject(s) - ball grid array , drop test , chip scale package , materials science , soldering , finite element method , integrated circuit packaging , semiconductor , semiconductor device , electronic packaging , reliability (semiconductor) , structural engineering , mechanical engineering , reliability engineering , engineering , composite material , integrated circuit , wafer , optoelectronics , power (physics) , physics , layer (electronics) , quantum mechanics
Proper design of semiconductors is the most essential step in ensuring electronic product reliability during manufacturing. The adoption of design optimization approach enhances the performance and reliability of the semiconductor package, hence, minimizes product failure. Semiconductor reliability especially in the application to automobiles is very crucial. High product failure tolerance in semiconductors in automobiles is required due to problems such as defects and malfunctions that are directly linked to casualty accidents. Such high tolerance requires keen quality control up to the semiconductor solder component level. This study aims to do a sensitivity analysis of the solder balls’ material properties and its effect on the stresses experienced by the semiconductor component with respect to its reliability using drop test. A drop test analysis was simulated wherein a shorter distance of 5 mm between the package and platform was implemented to make the simulation time faster. The density and modulus of elasticity of the solder ball material were identified as the independent factors while the stresses experienced by the BGA package during the drop test is the dependent variable. The results have shown that the maximum stress for all runs was found in the same area in the package. Changing the modulus of elasticity showed greater effect on the impact stress compared to the alteration of material density.