Open AccessDevelopment of Heat sink from Aluminium Silicon Carbide for Electrical and Electronic Applications
Author(s) -
O. Olaoluwayinka,
A.O. Inegbenebor,
Oluyemi Oyenike Fayomi,
N. E. Udoye,
P.O. Babalola
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1107/1/012214
Subject(s) - heat sink , silicon carbide , materials science , aluminium , thermal conductivity , electronics , metallurgy , silicon , carbide , composite material , mechanical engineering , electrical engineering , engineering
Heat sinks play a vital role in dissipating heat in electrical and electronic equipment. The heat sink device influences the overall efficiency, cost, and size of this equipment. Due to the development of the ever-evolving electronics market, new materials with a good thermal conductivity that can absorb and disperse heat away from high temperature and lightweight are sought for. As a result of this, searching for new materials with the tended properties to replace the traditional material is the focus of this work. The candidate materials choosing is aluminium silicon carbide composite because of its properties similar to the one needed for the heat sink. The aluminium silicon carbide composite was processed with different grits silicon carbide. Thereafter, additives with different oxide composition of calcium, zinc and chromium through the processing of stir and mechanical casting were used for the production of the samples. Nine samples in all were produced for the analysis and properties testing. The results show that density, electrical conductivity and thermal conductivity of produced samples are closely similar to the control sample. This preliminary result indicated that the developed heat sink sample could replace the traditional one.