
Melting dynamics of Gold thin film: A Molecular Dynamics study
Author(s) -
Riser Fahdiran,
Erfan Handoko,
Iwan Sugihartono,
Setia Budi
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1098/6/062061
Subject(s) - molecular dynamics , melting point , thin film , dynamics (music) , melting temperature , materials science , thermal conduction , thermodynamics , chemical physics , nanotechnology , chemistry , composite material , physics , computational chemistry , acoustics
We studied the melting dynamics of Gold in the form of thin film. The thin film thickness is 9.756 nm. The systems are heated from room temperature up to slightly above melting point, T m = 1338 K. The evolution of the atoms in each system is followed using Molecular Dynamics (MD) scheme up to 20 ps. Thermodynamics analysis indicated that thin film is suppressed by the uniform heat while the temperature is increasing. Structural analysis compared with Common Neighbor Analysis (CNA) expressed the condition that melting conduction occurred at the end of simulation.