Open AccessThermal aspect of material selection for substrate board equipped with high heat flux IC chips
Author(s) -
Shankar Durgam,
Ajinkya Bhosale,
Vivek Bhosale,
Revati Deshpande,
Pankaj Sutar
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1091/1/012005
Subject(s) - materials science , nusselt number , heat transfer , thermal conductivity , heat flux , heat transfer coefficient , laminar flow , multiphysics , thermodynamics , substrate (aquarium) , reynolds number , printed circuit board , heat sink , mechanics , convective heat transfer , composite material , electrical engineering , physics , engineering , finite element method , oceanography , turbulence , geology
This paper investigates the material selection for substrate board equipped with nine silicon heaters that mimic IC chips. This includes computational research on laminar forced convection air cooling of silicon IC chips in electronic components mounted on substrate boards subjected to high uniform heat fluxes in a horizontal channel. Copper clad boards with single and multilayer having thermal conductivities of 8.8, 40.5, and 61.5 W/m K are the substrate materials used in this study. Three-dimensional steady-state conjugate heat transfer with laminar non-isothermal fluid flow module is used from COMSOL Multiphysics 5.4 to study fluid flow and heat transfer. Simulations performed with flowing air velocities of 1.5, 2.5, and 3.5 m/s with very high heat fluxes of 10000, 12500, and 15000 W/m 2 . It showed that the temperature on subsrate board strongly depends upon placement of heaters, Reynolds number, substrate thermal conductivity. It also found that higher thermal conductivity substrate materials results in heat transfer enhancement and decrease chances of failures of electronic devices. A non-dimensional temperature based correlation is also devised in therms of non-dimensional heat flux, thermal conductivity, Nusselt number, and Reynolds number.