Open AccessFlattening analysis of plastically graded cylindrical contact under plane stress condition
Author(s) -
Tamonash Jana,
Anirban Mitra,
Prasanta Sahoo
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1080/1/012017
Subject(s) - flattening , cylinder , finite element method , materials science , contact mechanics , slip (aerodynamics) , plane stress , mechanics , stress (linguistics) , contact area , exponential function , geometry , contact analysis , plane (geometry) , structural engineering , composite material , mathematics , physics , mathematical analysis , engineering , linguistics , philosophy , thermodynamics
The present work deals with finite element based flattening analysis of a functionally graded cylindrical contact against a rigid flat surface under plane stress condition. The yield strength of the semi-cylinder is varied radially according to an exponential function. The contact between the semi-cylinder and the rigid flat is considered to be perfect-slip type in nature. To reduce the computational time, a 2D quarter circle is used to model the cylinder and rigid flat surface is modelled using a straight line. The effect of the gradation parameter on contact behaviours e.g. contact area, contact force, contact pressure etc. of the semi-cylinder are presented and discussed.