Open AccessResearch and Analysis of Software Defect Measurement Elements Based on Analytic Hierarchy Process
Author(s) -
Zhonghua Xu,
Long-Ting Wu,
Renya He,
Xinyu Han,
Longli Tang
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1043/3/032015
Subject(s) - analytic hierarchy process , computer science , software quality , software , hierarchy , reliability engineering , verification and validation , quality (philosophy) , software sizing , software metric , process (computing) , analytic network process , data mining , software engineering , software construction , software development , engineering , statistics , operations research , mathematics , programming language , philosophy , epistemology , economics , market economy
It is not convenient for the general software quality evaluation system to be directly and quickly applied to the software quality evaluation to be tested. Therefore, this paper proposes a method suitable for the analysis of factors affecting software quality based on analytic hierarchy process. The analytic hierarchy process is used as the main framework, the distribution of the software’s own properties and accumulated test findings as input,the constructed defect weight ratio is used as the judgment matrix, Then do the hierarchical analysis. Through the analytic hierarchy process to analyse the weight of the factors of the software itself, test organizations can quickly make a fuzzy assessment of software quality, and provides the reference basis for the reasonable allocation of test resources.