Open AccessChallenges in packaging of IR detectors - technology of elastic electrical connections
Author(s) -
Marcin Myśliwiec,
Arkadiusz Lewandowski,
Wojciech Wiatr,
Jerzy Weremczuk,
Z Szczepański,
Ryszard Kisiel
Publication year - 2016
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/104/1/012007
Subject(s) - detector , soldering , materials science , connection (principal bundle) , dip soldering , optoelectronics , eutectic system , printed circuit board , electrical engineering , photodetector , mechanical engineering , electronic engineering , wave soldering , composite material , engineering , alloy