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Low-temperature thermal conductivity of highly porous copper
Author(s) -
G Tomás,
Dagoberto Martins,
Alexander G. Cooper,
G. Bonfait
Publication year - 2015
Publication title -
iop conference series. materials science and engineering
Language(s) - Uncategorized
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/101/1/012004
Subject(s) - porosity , thermal conductivity , copper , materials science , heat exchanger , porous medium , characterization (materials science) , cryogenic temperature , composite material , thermal , conductivity , metallurgy , nanotechnology , mechanical engineering , chemistry , thermodynamics , engineering , physics

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