Open AccessDevelopment Method for Nickel Electroplating on Aluminium
Author(s) -
Tjokorda Gde Tirta Nindhia,
Dewa Ngakan Ketut Putra Negara,
I Wayan Agus Saputra,
Pradeep Sharma
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1007/1/012105
Subject(s) - electroplating , nickel , materials science , metallurgy , plating (geology) , aluminium , copper , zinc , coating , tribology , layer (electronics) , composite material , geophysics , geology
Aluminum is important material due to high strength/weight ratio. Nickel plating is proposed on luminium for the purpose of improving wear resistance, tribological properties, surface hardness, and decorative appearance. There are number of difficulties when electroplating nickel on luminium is expected. The luminium is amphoteric are soluble in both alkaline and acid. The potential difference between luminium and nickel can affect the deposition reaction due to the diameter and the crystal lattice structure of both different atoms. This study developed nickel electroplating on luminium. Copper and zinc are used as intermediate deposits and final pretreatment coating performed with nickel plating. Interface layers that have been produced are investigated to determine the quality of the nickel layer is obtained.