Open AccessThe Influences of Silver Content in Lead-Free Solder Sn-0,7CuxAg (SAC) in Physical and Mechanical Properties
Author(s) -
Erwin Siahaan,
Abrar Riza
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1007/1/012025
Subject(s) - soldering , materials science , alloy , metallurgy , copper , melting temperature , lead (geology) , shear strength (soil) , composite material , environmental science , soil science , soil water , geomorphology , geology