Open AccessEnhancement of maltodextrin-based adhesive properties using ammonium dihydrogen phosphate (ADP)
Author(s) -
Greitta Kusuma Dewi,
Ragil Widyorini,
Ganis Lukmandaru
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.179
H-Index - 26
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/891/1/012004
Subject(s) - maltodextrin , adhesive , materials science , thermogravimetric analysis , chemistry , nuclear chemistry , ammonium dihydrogen phosphate , chromatography , organic chemistry , composite material , layer (electronics) , fertilizer , spray drying
Maltodextrin is a new saccharide-based adhesive that can be potentially developed as an alternative for particleboard due to its abundant resources. The addition of ammonium dihydrogen phosphate (ADP) was expected to be able to improve the properties of the maltodextrin, especially the water resistance of the cured adhesive. This study aimed to investigate the properties of maltodextrin/ADP adhesive in the ratios of 100/0, 90/10 and 80/20 wt%. The results showed that the increasing ratio of ADP in maltodextrin-based adhesive can increase not only the insoluble matter rate during boiling condition, but also the other adhesive properties of maltodextrin by lowering the viscosity and increasing the wettability tested in salacca frond particles. The pH adhesive decreased along with the increased ADP ratio. Oneway analysis of variance and Tukey test showed that the maltodextrin/ADP ratios significantly affected the adhesive properties. The thermogravimetric analysis (TGA) of dried mixture adhesive showed the significant changes in the onset and the highest weight reduction temperature of maltodextrin after the ADP addition. The FTIR analysis detected some new peaks that were expected to be related to furan ring and carbonyl groups after the maltodextrin/ADP 90/10 and 80/20 wt% were heated at 200°C for 10 minutes and/or 15 minutes. Maltodextrin/ADP 80/20 wt% had the best adhesive properties for particleboard application.