Open AccessFinite Element Analysis of Peltier Effect based Thermoelectric Energy Conservation Cooling System for Microprocessors
Author(s) -
Weishen Chu,
Lv Jiahe,
Nan Hong
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/804/3/032056
Subject(s) - thermoelectric cooling , thermoelectric effect , finite element method , microprocessor , thermoelectric generator , water cooling , thermoelectric materials , mechanical engineering , materials science , current (fluid) , electrical engineering , electronic engineering , engineering physics , engineering , optoelectronics , computer science , physics , thermodynamics , structural engineering
Chip cooling technologies have been attracting researchers’ interests as the wiring density in integrated circuits increases dramatically in recent chip design. A Peltier effect based thermoelectric cooling system is designed for microprocessor cooling. A 3D Finite Element Analysis model is developed to validate, analyse, and optimize the performance of the thermoelectric cooling system. The effects of microcooler size and activation current have been studied by thermo-electric coupled field analysis. It has been found that the Peltier effect based thermoelectric cooling system can successfully reduce the temperature of microprocessors and the optimum activation current for the cooling system has been determined.