Open AccessModeling and Analysis of Heat transfer of Resolder Furnace based on Thermodynamics
Author(s) -
Yunge Liu
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/769/4/042110
Subject(s) - heat transfer , thermal conduction , printed circuit board , welding , thermodynamics , convection , convective heat transfer , mechanics , heat transfer coefficient , materials science , process (computing) , mechanical engineering , engineering , computer science , metallurgy , electrical engineering , physics , operating system
In the production process, the printed circuit board with all kinds of electronic components is placed in the rewelding furnace and the electronic components are automatically welded to the circuit board by heating. In this production process, the temperature control of the resolder furnace is very important to ensure the product quality. In this paper, by analyzing the heat transfer characteristics of rewelding furnace, the three-dimensional problem is transformed into one-dimensional problem, and the transient heat transfer process is studied and analyzed. Considering the two heat transfer modes of heat conduction and heat convection, the partial differential equation model of one-dimensional double-layer heat conduction is constructed, and the classical mathematical and physical method is used to model and simulate the heat conduction in the welding process of printed circuit board. the variation diagram of the furnace temperature curve and the temperature in the center of the welding zone at different positions in the small temperature zone are obtained.