
Transient Analysis Based on Finite Element Method for Ball Grid Array Package
Author(s) -
Wenhao Luo,
Wei Su,
Xianshan Dong,
Zhenhua Nie,
Agam Tomar
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/769/4/042004
Subject(s) - ball grid array , workbench , finite element method , fixture , transient (computer programming) , grid , sheet metal , computer science , ball (mathematics) , structural engineering , mechanical engineering , engineering , materials science , composite material , mathematics , visualization , geometry , soldering , operating system
In this paper, finite element simulation is carried out for BGA sample. The authors establishes the model of fixture, ceramic panel and metal sheet. Based on this model, several layers papers are laid on the metal sheet for simulation test. Then, ANASYS Workbench is used to conduct transient analysis of the samples to study the influence of different thickness papers on acceleration and time. The results provide useful reference for the adjustment of dynamic response parameters.