Open AccessNumerical Simulation of Random Vibration Analysis for Ball Grid Array Package
Author(s) -
Wenhao Luo,
Wei Su,
Xianshan Dong,
Zhenhua Nie,
Agam Tomar
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/769/3/032005
Subject(s) - ball grid array , workbench , finite element method , vibration , natural frequency , grid , ceramic , fixture , ball (mathematics) , computer science , structural engineering , mechanical engineering , engineering , materials science , acoustics , composite material , mathematics , physics , geometry , visualization , soldering
This paper uses ANSYS Workbench (a finite element analysis software) to simulate BGA ceramic packing. The author models fixture, ceramic and metal steel. Then different thickness papers are laid on the BGA product. By random vibration analysis, the natural frequency and mode of the sample are obtained. According the results, the author discusses the relationship between different thickness papers and PSD-frequency curve. It provides a benefit instruction for the design of BGA packing.