Open AccessEffects of alloying elements on the dissolution and diffusion of Bi in Sn: A first-principles study
Author(s) -
Lu Sun,
Yan Jiang,
Limin Wang,
Wei Xiao
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/657/1/012018
Subject(s) - dissolution , materials science , diffusion , soldering , precipitation , metallurgy , doping , atomic units , chemical physics , chemical engineering , thermodynamics , chemistry , physics , optoelectronics , quantum mechanics , meteorology , engineering
Interfacial Bi segregation in Sn-based solders is a critical issue that affects the reliability of solder joints. Doping alloying elements into Sn-Bi solders is considered as a potential way to improve the Bi precipitation. We provided insights into the mechanism of Bi segregation at the atomic scale, by calculating the dissolution and diffusion energies of Bi in the Sn bulk. Importantly, we investigated the effects of alloying elements on the Bi dissolution and diffusion, which varies much with element species. The addition of elements such as Pt, Pd, and Au could enhance the dissolution and weaken the diffusion of Bi in the Sn bulk, thus suppressing the interfacial Bi segregation to some extent. However, other elements such as In, Ag, Sb, and Ga have slight impacts on the dissolution and diffusion of Bi. The bonding characters between the third elements, Bi, and Sn atoms explain different influences of alloying elements on Bi segregation in Sn-based solders.