Open AccessWave Soldering Coupled Thermal-mechanical Simulation of Multi-layer Ceramic Capacitors
Author(s) -
Wei Su,
Wenhao Luo,
Junkui Li,
Renhuai Liu
Publication year - 2021
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/632/4/042051
Subject(s) - materials science , thermal conduction , soldering , finite element method , stress (linguistics) , thermal , wave soldering , coupling (piping) , ceramic capacitor , stress field , mechanics , composite material , capacitor , structural engineering , thermodynamics , electrical engineering , engineering , voltage , physics , linguistics , philosophy
In this paper, the thermal-mechanical coupling finite element analysis of MLCC wave soldering with heat conduction and heat convection is calculated, and the steady-state temperature field and transient temperature field as well as the stress distribution of MLCC are obtained. Using the finite element analysis method of indirect thermal-mechanical coupling, the stress analysis is carried out with the temperature field as the boundary condition, and the thermal-structural coupling model is established. By analyzing the thermal stress of MLCC, the weak parts sensitive to thermal stress are determined, which provides a useful reference for solving the reliability problem of MLCC wave soldering.