Open AccessMolecular dynamics simulation of the microscopic interaction in Cu/water nanofluid
Author(s) -
Liang Zhang,
Linchao Tian,
Anlong Zhang,
Pingping Qu,
Yuyan Jing,
Hemin Chen
Publication year - 2020
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.179
H-Index - 26
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/585/1/012135
Subject(s) - nanofluid , thermal conductivity , molecular dynamics , materials science , nanoparticle , base (topology) , atom (system on chip) , radial distribution function , chemical physics , thermal , combustion , thermodynamics , nanotechnology , composite material , chemistry , physics , computational chemistry , mathematical analysis , mathematics , embedded system , computer science
With the gradual increase in internal combustion engine load, the heat in the cooling oil cavity has been insufficient to remove too much heat in a timely manner. The excellent thermal conductivity of nanofluids can be used to consider solving such problems. In this paper, the molecular dynamics simulation of the microscopic effect of the particles in the Cu/water nanofluid on the base fluid is carried out by the equilibrium molecular dynamics method. By analyzing the density distribution of various atoms in the nanofluid and the radial distribution function between the base fluid atoms, Cu-H and Cu-O atom pairs, it is found that the main reason for the influence of the nanoparticles on the base fluid is in the area near the Cu particles. The base fluid atoms have an effect, which changes the arrangement of these atoms, and the O atoms around the nanoparticles are closer to the surface of the Cu particles, and the H atoms are slightly away from the surface of the particles.