z-logo
open-access-imgOpen Access
A planar heat conduction element improving temperature-related simulation accuracy
Author(s) -
Jun Duan,
Yuxin Ban
Publication year - 2020
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/510/5/052085
Subject(s) - thermal conduction , finite element method , planar , quadrilateral , mechanics , relativistic heat conduction , materials science , interpolation (computer graphics) , heat transfer , thermodynamics , physics , classical mechanics , computer science , composite material , motion (physics) , computer graphics (images) , heat flux
In the numerical study of temperature field in the fields of freezing and thawing cycles in cold regions, geothermal energy and functionally graded materials, the selection of heat conduction elements of the finite element method has an important influence on the numerical calculation results. Based on the fundamental solution and heat conduction theory, the fundamental solutions of the two-dimensional heat conduction control equation were added in the temperature interpolation function of the conventional planar 4-node quadrilateral heat conduction element. A new planar heat conduction non-coordination element with the fundamental solutions was established. The element interpolation function and the stiffness matrix were derived, and the element convergence was examined. The calculation accuracy was compared among the plane heat conduction non-coordination element with the fundamental solutions, the conventional finite element method and the analytical solution. The results showed that the planar heat conduction non-coordination element with the fundamental solutions proposed in this paper is high in calculation method and precision.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here