Open AccessDesign of Heat Sink in Power Electronic Device Using Liquid Metal
Author(s) -
Peng Zhang,
Ronggang Han,
Dehui Wang,
Biao Yan
Publication year - 2020
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/453/1/012061
Subject(s) - heat sink , dissipation , water cooling , materials science , liquid metal , computer cooling , passive cooling , electronics , nuclear engineering , thermal management of electronic devices and systems , power electronics , insulated gate bipolar transistor , power (physics) , power module , mechanical engineering , mechanics , thermodynamics , heat transfer , electrical engineering , engineering , metallurgy , physics
Most converter valves of IGBT modules use a water-cooling system. The cooling technology of water cooling system is mature and has considerable advantages. However, higher power density power electronics lead to greater cooling power. With the improvement of the heat dissipation power of power electronic devices, the traditional water cooling system will gradually fail to meet the heat dissipation requirements of power electronic devices, and new cooling systems need to be developed. In this paper, based on the existing traditional water-cooling system model, numerical simulation analysis technology is used to compare and analyze the different cooling materials (copper, aluminum) and cooling medium (water, liquid metal) under the working conditions. For deionized water and liquid metal, the heat dissipation effect is compared and analyzed, which shows that the heat dissipation performance of the heat dissipation system using copper and liquid metal is greatly improved. Based on this, the model of liquid metal heat dissipation system is proposed. Compared with the traditional cooling model, it shows its superiority in heat dissipation performance with highest temperature decreased by 20.4%.