Open AccessHeat Transfer Analysis for New Product Development
Author(s) -
Taufik Roni Sahroni
Publication year - 2020
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.179
H-Index - 26
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/426/1/012129
Subject(s) - printed circuit board , heat transfer coefficient , heat transfer , mechanical engineering , reliability (semiconductor) , materials science , degeneracy (biology) , mechanics , mass transfer , power (physics) , electrical engineering , thermodynamics , engineering , physics , bioinformatics , biology
This project presents an analysis of heat and mass transfer in designing a new product development. The problem in designing of electronic components to be mounted in Printed circuit board (PCB) is very complex due to significantly influence to reliability, safety, and cost effective. The objective of this study is to carry out the current problems related with heat and mass transfer analysis. The methodology used is started from cross-sectional heat transfer surface, Reynolds Number, heat transfer coefficient, heat flux, and last the maximum total power required. The result shows that a 15cm x 20cm of Printed Circuit Board (PCB) has an optimal heat and mass transfer coefficient to meet reliability and safety. In addition, the power degeneracy as function of the air velocity and the surface temperature are plotted. The simulation was generated, and it is represent the air velocity is vary from 1 m/s to 15 m/s and the external temperature surrounding on the printed circuit board is identified from 30°C to 100°C. As the result, the comprehensive value of heat and mass transfer coefficient is presented for new product development purposes.