Open AccessAn improved thermal network model of the IGBT module for wind power converters considering the effects of base plate solder fatigue
Author(s) -
H Li,
Hao Yu,
S Q Liu,
Y Li,
Xinglin Liao,
Z X Liu
Publication year - 2016
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.179
H-Index - 26
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/40/1/012001
Subject(s) - junction temperature , soldering , insulated gate bipolar transistor , converters , finite element method , thermal , thermal resistance , power module , power (physics) , base (topology) , coupling (piping) , materials science , mechanical engineering , structural engineering , engineering , electrical engineering , composite material , physics , voltage , meteorology , mathematical analysis , mathematics , quantum mechanics