Open AccessExperimental Study of Electrochemical Micro-milling of Silicon
Author(s) -
Hui Chen
Publication year - 2019
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/267/6/062058
Subject(s) - electrochemical machining , machining , materials science , passivation , electrochemistry , silicon , corrosion , sodium hydroxide , surface micromachining , metallurgy , nanotechnology , electrode , fabrication , chemical engineering , engineering , chemistry , electrolyte , medicine , alternative medicine , layer (electronics) , pathology
Electrochemical machining (ECM) is a common method of silicon micromachining, but it is difficult to be directly used for three-dimensional processing. Therefore a new electrochemical micro-milling (ECMM) method is proposed. The method combined electrochemical machining and milling processes technology. Micro-removal of materials can be achieved by electrochemical machining technique, while milling processes enable three-dimensional machining. ECMM utilizes the passivation of silicon in sodium hydroxide solution to reduce electrochemical stray corrosion and improve processing accuracy. Experiments showed that the ECMM technology can limit the electrochemical stray corrosion to less than 10 μm. This method can be used for the machining of tiny three-dimensional structures of silicon materials.