
Study on Adhesive Mechanism and Sizing Process of Wheat Straw Board in Interior Decoration
Author(s) -
Xuejiao Bai,
Xufang Liang
Publication year - 2019
Publication title -
iop conference series. earth and environmental science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.179
H-Index - 26
eISSN - 1755-1307
pISSN - 1755-1315
DOI - 10.1088/1755-1315/237/5/052070
Subject(s) - adhesive , isocyanate , straw , urea formaldehyde , glue , materials science , bonding strength , sizing , composite material , formaldehyde , layer (electronics) , chemistry , organic chemistry , polyurethane , inorganic chemistry