Open AccessA bendable and compactdevice for low-power application
Author(s) -
E. Ortiz-Ortega,
M.P. Gurrola,
L.G. Arriaga,
J. LedesmaGarcía
Publication year - 2015
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/660/1/012054
Subject(s) - materials science , formic acid , reliability (semiconductor) , fuel cells , polyester , microfluidics , adhesive , work (physics) , power density , power (physics) , oxygen , chemical engineering , process engineering , automotive engineering , electrical engineering , nanotechnology , engineering physics , optoelectronics , composite material , mechanical engineering , engineering , chemistry , organic chemistry , layer (electronics) , physics , quantum mechanics