
An apparatus for measurements of thermal conductivity and thermal expansion based on GM cryocooler
Author(s) -
Huiming Liu,
Dong Xu,
Peng Xu,
Rongjin Huang,
Xiaodong Xu,
Laifeng Li,
Linghui Gong
Publication year - 2012
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/400/5/052017
Subject(s) - thermal conductivity , cryocooler , materials science , sample (material) , thermal conductivity measurement , thermal expansion , mechanical engineering , strain gauge , gauge (firearms) , thermal , heat flow , thermal conduction , composite material , mechanics , nuclear engineering , thermodynamics , engineering , metallurgy , physics