Open AccessHigh Productivity DRIE solutions for 3D-SiP and MEMS Volume Manufacturing
Author(s) -
M. Puech,
JM Thevenoud,
N. Launay,
N. Arnal,
P. Godinat,
B. Andrieu,
J. M. Gruffat
Publication year - 2006
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/34/1/079
Subject(s) - deep reactive ion etching , microelectromechanical systems , volume (thermodynamics) , wafer , through silicon via , throughput , three dimensional integrated circuit , ram air turbine , silicon , materials science , automotive engineering , electronic engineering , computer science , engineering , mechanical engineering , etching (microfabrication) , turbine , optoelectronics , nanotechnology , integrated circuit , telecommunications , reactive ion etching , quantum mechanics , wireless , physics , layer (electronics)