Open AccessStructural investigation in Cu-In-Sn alloys around 60 at.% Cu for Pb-free transient liquid phase bonding
Author(s) -
S. Sommadossi,
G. Aurelio,
G.J. Cuello
Publication year - 2011
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/325/1/012026
Subject(s) - transient (computer programming) , materials science , phase (matter) , liquid phase , copper , metallurgy , crystallography , chemistry , thermodynamics , physics , computer science , organic chemistry , operating system