
Experimental study on the removal behavior of SiCf/SiC by traditional and ultrasonic vibration assist scratching with single grain diamond
Author(s) -
Wenzhao An,
Songmei Yuan,
Xiangmin Ouyang,
Wei Jia,
Z K Zhang,
Yi Luo
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2348/1/012012
Subject(s) - scratching , materials science , composite material , scratch , brittleness , extrusion , diamond , ultrasonic sensor , vibration , acoustics , physics