
Computational cooling performance of electronic chips on printed circuit boards
Author(s) -
Shankar Durgam
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2312/1/012071
Subject(s) - printed circuit board , natural convection , materials science , thermal , substrate (aquarium) , copper , forced convection , convection , mechanical engineering , work (physics) , epoxy , composite material , electrical engineering , mechanics , metallurgy , engineering , thermodynamics , physics , geology , oceanography