Open AccessOptimization and Solution of the Temperature Curve of Reflow
Author(s) -
Zishuai Zu,
Hanbing Liu
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2228/1/012025
Subject(s) - reflow soldering , printed circuit board , heat transfer coefficient , heat transfer , materials science , firmware , thermal conduction , mechanical engineering , mechanics , convection , convective heat transfer , thermodynamics , electrical engineering , engineering , computer science , composite material , physics , computer hardware
In the production process of electronic products such as process integrated circuit boards, some firmware needs to be heated and soldered to the circuit board through a reflow furnace. In this process, the temperature setting of each temperature zone and the control of the furnace passing speed play a vital role in the quality of the product. By consulting the data, it is known that the reflow heats the welding area by impinging jets, and it is considered that the heat transfer in the reflow is carried out by heat convection. Using Newton’s law of cooling, the three-dimensional heat transfer process is simplified to a two-dimensional unsteady heat transfer problem. Taking into account the lag of the center temperature of the circuit board relative to the surface temperature, it is considered that the heat transfer in the circuit board is carried out by heat conduction, and the physical parameters such as the density and heat transfer coefficient of the circuit board and the soldering area are integrated into a constant τ. The known data is obtained, and the temperature change law model is finally established.