Open AccessResearch on Ultrasonic-Assisted Grinding Process of SiCp/Al Composites
Author(s) -
Changxing Zhu,
Tao Zhang,
Gu Ping,
Yiqing Yu
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2200/1/012015
Subject(s) - grinding , materials science , abrasive , ultrasonic sensor , surface roughness , brittleness , composite material , machining , surface finish , ultrasonic machining , metallurgy , acoustics , physics
SiCp/Al is a kind of particle reinforced composites with good material properties, which can be used in the field of lightweight parts and electronic packaging. Ultrasonic- assisted grinding process is one of the processes which is suitable for machining hard and brittle materials, the surface quality can be improved by using appropriate ultrasonic-assisted process parameters. In this paper, the ultrasonic-assisted grinding process is used to improve the surface quality of SiCp/Al, meanwhile, the kinematics of abrasive particles in grinding is analysed to explain the effect of ultrasonic vibration. In addition, ultrasonic-assisted grinding experiment of SiCp/Al is conducted, it is found that the axial ultrasonic vibration can improve the surface quality of SiCp/Al in grinding, and the reduction percentage is up to 8.20% compared to the normal grinding. In addition, a regression model is proposed for surface roughness prediction, the result of t-test on the residuals shows that the model is accurate.