
Modeling and Simulation Analysis of the Temperature Field of High Speed Missile Cabin
Author(s) -
Long Yi,
Yuliang Li,
Jindong Ouyang,
Liping Zhu,
Zhang Yaoqing
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2179/1/012007
Subject(s) - missile , heat transfer , thermal conduction , convection , aerospace engineering , thermal radiation , thermal , natural convection , heat transfer coefficient , software portability , mechanical engineering , engineering , simulation , computer science , mechanics , meteorology , materials science , physics , composite material , thermodynamics , programming language
A temperature field analysis method is developed for the cabin of high-speed missile. The high fidelity three-dimensional model of the thermal protection system is build based on the finite element method, including structure and equipments inside the cabin. The model can express the heat conduction path, radiation relationship and the heat capacity of the equipment. The aero-heating and heat transfer are solved simultaneously. The convection coefficient relevant to experiment is used to simulate the heat transfer of the gas in the cabin. It can be used to large-scale engineering calculation for the thermal protection system of high-speed aircraft. The numerical example of a head cabin for high-speed missile shows that the obvious regional characteristics of the surface temperature outside the cabin is presented, which reflects the coupling effect of aero-heating and cabin structure. The temperature of the equipment in the cabin rises due to radiation and convection heat transfer. Heat capacity of the equipment and natural convection in the gap have obvious influence on the rate and amount of temperature rising. The developed APDL command stream can integrate commercial software of CAD and CAE. It is suitable for large and complex engineering structure because of the advantages such as high computational efficiency and strong portability.