Open AccessReduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection
Author(s) -
Zhen Lv,
Chenfei Zhou,
Johan Liu,
Xiuzhen Lu
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2174/1/012061
Subject(s) - materials science , copper , thermal resistance , coating , sheet resistance , interconnection , chemical vapor deposition , thermal , layer (electronics) , interfacial thermal resistance , nano , thermal conductivity , composite material , metallurgy , optoelectronics , computer network , physics , meteorology , computer science
Reduction of the thermal resistance between graphene films (GFs) and substrate is crucial to the application of GFs in thermal management. GFs/copper structures were prepared using nano-Ag paste as interconnection material. The effect of the thickness of nano-Ag paste on thermal resistance of GFs/copper structure was investigated. A thin layer of Ag was coated on GFs by physical vapor deposition (PVD) to further reduce thermal resistance. The thermal resistance of GFs/copper structure using Ag-coated GFs is 5.84% lower than that using raw GFs. The thermal resistance of GFs/copper structure decreases first and then increases with the increase of coating temperature and thickness of Ag layer. The minimum thermal resistance of 1.64 mm 2 ·K·W −1 was gained for GFs/copper structure using GFs coated Ag at 300 °C for 60 min.