Open AccessInfluence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints
Author(s) -
Flora Somidin,
Nur Fatin Natasha Ilias,
Nur Syahirah Mohamad Zaimi,
Mohd Izrul Izwan Ramli,
Nurul Razliana Abdul Razak
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2169/1/012032
Subject(s) - materials science , soldering , microstructure , ceramic , intermetallic , metallurgy , geopolymer , solder paste , composite material , powder metallurgy , composite number , layer (electronics) , fly ash , alloy
This paper reports the effect of 1.0 wt.% fly ash (FA) geopolymer ceramic powder addition in Sn-3.0Ag-0.5Cu (SAC305, in wt.%) solder joint. Powder metallurgy route was used to fabricate the new composite solder. Solder balls were formed from the new composite solder and reflowed on Cu substrate. The effect of FA as ceramic reinforcement on the bulk microstructure and the interfacial intermetallic compound layer formation of solder joints were investigated under optical microscope. Microstructure observation showed that the β-Sn dendrite size was refined in SAC305-1.0FA/Cu bulk solder joint sample than that in the non-reinforced sample. The addition of FA geopolymer ceramic powder into the solder matrix also produced a thinner intermetallic compound layer.