Open AccessMicrostructural Evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu Composite Solder Joint during Isothermal Aging
Author(s) -
Flora Somidin,
Muhammad Fakarudin Abu Bakar,
Nurul Razliana Abdul Razak
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2169/1/012024
Subject(s) - soldering , materials science , composite number , isothermal process , microstructure , solderability , joint (building) , solder paste , composite material , reflow soldering , metallurgy , substrate (aquarium) , architectural engineering , oceanography , physics , engineering , thermodynamics , geology
A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.