Open AccessEffect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach
Author(s) -
Fateh Amera Mohd Yusoff,
Maria Abu Bakar,
Azman Jalar
Publication year - 2022
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2169/1/012002
Subject(s) - materials science , nanoindentation , alloy , modulus , composite material , soldering , compression (physics) , elastic modulus , metallurgy , indentation hardness , bar (unit) , control sample , microstructure , physics , food science , chemistry , meteorology
The relationship between a process and mechanical properties are important in understanding the behaviour of a material under certain conditions. This indicate that mechanical properties of the materials can be modified through certain processing. Hence, this paper investigates the effect of 60% thickness reduction of Sn-Cu alloy in thermomechanical treatment on the localized micromechanical properties. A bar-shape of Sn-Cu solder alloy is subjected to heat treatment at 30°C, 60°C, 90°C, 120°C and 150°C for 20 minutes, followed by 60% thickness reduction via compression process. Sample without compression process was used as control sample. Nanoindentation approach was used to characterize the localized micromechanical properties of the samples. The results show the hardness value for control samples reduced approximately 56%, from 181 MPa at 30°C to 79 MPa at 150°C. Reduced modulus of control sample has shown similar decreasing trend from 149 GPa at 30°C to 85 GPa at 150°C, approximately 43% changes. Lower changes in hardness and reduced modulus observed for thermomechanical treated sample approximately 20% and 18%, respectively. These findings show that thermomechanical treatment has given significant effect on the localized micromechanical properties of Sn-Cu solder alloy.