Open AccessResearch of the influence of bias voltage on the structure and residual stress in Ta/W coatings applied on a copper substrate by inverted magnetron
Author(s) -
А. А. Лозован,
A. S. Lenkovets,
N. P. Ivanov,
T. S. Sukhova
Publication year - 2021
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/2144/1/012012
Subject(s) - materials science , residual stress , layer (electronics) , substrate (aquarium) , cavity magnetron , copper , composite material , coating , stress (linguistics) , metallurgy , sputter deposition , texture (cosmology) , thin film , sputtering , nanotechnology , oceanography , linguistics , philosophy , image (mathematics) , artificial intelligence , computer science , geology
This paper presents the results of studying the effect of the bias voltage on a copper tube substrate on the texture and residual stresses in 4-layer Ta/W/Ta/W coatings deposited with an inverted magnetron. It is shown that, in contrast to monolayer coatings of Ta and W, in which residual stresses exceeding 2 GPa are formed on the substrate at high voltages on the substrate, stress relaxations occur in the 4-layer coating in alternating layers differing in LTEC values and in the outer W-layer of stress practically absent.